English  |  正體中文  |  简体中文  |  Items with full text/Total items : 16335/24215 (67%)
Visitors : 13336860      Online Users : 497
RC Version 7.0 © Powered By DSPACE, MIT. Enhanced by NTU Library IR team.
Scope Tips:
  • please add "double quotation mark" for query phrases to get precise results
  • please goto advance search for comprehansive author search
  • Adv. Search
    HomeLoginUploadHelpAboutAdminister Goto mobile version
    Please use this identifier to cite or link to this item: http://ir.nknu.edu.tw/ir/handle/987654321/22062

    題名: Chip-package-board codesign of highly linear 3G-CDMA upconverter modules
    Authors: Jian-Ming Wu;F. Y. Han;T. S. Horng;C. C. Tu;R. Chen;C.H. Chu
    Date: 2005-06
    Issue Date: 2014-11-14 14:55:49 (UTC+8)
    關聯: IEEE Electronic Components and Technology Conference, pp. 528-531,Jun. 2005
    Appears in Collections:[電子工程學系] 會議論文
    [電子系] 吳建銘

    Files in This Item:

    File SizeFormat

    All items in NKNUIR are protected by copyright, with all rights reserved.

    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library IR team Copyright ©   - Feedback