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    Please use this identifier to cite or link to this item: http://ir.nknu.edu.tw/ir/handle/987654321/22062


    題名: Chip-package-board codesign of highly linear 3G-CDMA upconverter modules
    Authors: Jian-Ming Wu;F. Y. Han;T. S. Horng;C. C. Tu;R. Chen;C.H. Chu
    吳建銘
    Date: 2005-06
    Issue Date: 2014-11-14 14:55:49 (UTC+8)
    關聯: IEEE Electronic Components and Technology Conference, pp. 528-531,Jun. 2005
    Appears in Collections:[電子工程學系] 會議論文
    [電子系] 吳建銘

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